Tool Location
111
Training
For training, please contact the Tool Manager(s).
Compatibility:
Additional Restrictions
- Metals should not be exposed to the plasma.
- Tool requires material to be mounted to a tape frame. 200mm, 150mm, and 100mm wafers, as well as pieces can be mounted to the frame and etched.
Manager
Backups:
Capabilities
- Deep silicon etch for wafer dicing
- Heated Chamber Lid and Upper Chamber Liners
- Cold Mode Protection Ring
- Fluid-cooled electrode -Electrostatic clamping
Applications
Able to etch through Silicon wafers with photoresist mask all the way to the edge of the wafer by mounting on a dicing frame. Works with chips or wafers up to 200mm