For training, please contact the Tool Manager(s).

Compatibility:
2 - Silicon Based Substrates and Select Refractory Metals
Additional Restrictions
  • Metals should not be exposed to the plasma.
Manager
Jeremy Clark
Backups:
Aaron Windsor
Capabilities
  • Deep silicon etch for wafer dicing
  • Heated Chamber Lid and Upper Chamber Liners
  • Cold Mode Protection Ring
  • Fluid-cooled electrode -Electrostatic clamping
Applications

Able to etch through Silicon wafers with photoresist mask all the way to the edge of the wafer. Works with chips or wafers up to 200mm

Equipment Information Sheet