SUSS MicroTech MJB4 Contact Lithography Exposure Tool

In CULearn, sign up for course:

Make sure before you request contact aligner training you have completed General Lithography Training.

Compatibility:
5 - Class A and B Metals and Compounds
Additional Restrictions
  • 5" Mask size
  • Substrate size from about 5mm square to 100mm in diameter.
  • Backside of the substrate must be clean. No wet Resist.
Manager
Garry Bordonaro
Backups:
Christopher Alpha
Suss MJB4

The MJB4 contact aligner can be used for Topside Alignment and Backside Infrared Alignment on substrate sizes ranging 5mm square to 100mm in diameter. It is capable of printing 0.7um lines and spaces with a 365-436nm light source. This contact aligner has 5 exposure modes; Soft Contact, Hard Contact, Vacuum Contact, Soft Vacuum Contact and Gap Exposure. Alignment travel range for X and Y is +/- 5mm and 5 degrees for theta.

Capabilities
  • Topside and backside IR alignment
  • Wavelength from 365nm - 436nm
  • Minimum 0.7um line/space
Equipment Information Sheet
Links:
Contact Lithography Alignment Keys
Resources:
Contact Aligner Resist Matrix
Contact Lithography Alignment Keys
General Photolithography Information
Contact Alignment Notes