F40

  • Wavelength range: 400 - 850 nm
  • Thickness measurement range: 20 nm - 40 µm
  • Microscope mounted.
  • Single point measurement.
  • Up to 150 mm wafer size.

F50

  • Wavelength range: 380 - 1050 nm
  • Thickness measurement range: 20 nm - 70 µm
  • Wafer mapping capability on up to a 200 mm substrate.
  • Located in the Photolithography suite.
  • Yellow light filter for measrement of UV sensitive films.

F40-UV

  • Wavelength range: 190 - 1100 nm
  • Thickness measurement range: 4 nm - 10 µm
  • Single point measurement.
  • All wafer and piece sizes.

F50-EXR

  • Wavelength range: 380 - 1700 nm
  • Thickness measurement range: 20 nm - 250 µm
  • Wafer mapping capability on up to a 200 mm substrate.